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Current IssueBreaking High-speed Material Constraints
Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems. Learn more in this issue.
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This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
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In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
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epoxySet Introduces EO-20E – Versatile, Electrically Conductive Epoxy
April 29, 2024 | epoxySetEstimated reading time: Less than a minute
epoxySet produces EPOXIOHM™ EO-20E an industry established, reliable electrically conductive epoxy designed for solder replacement, chip bonding and other intricate electronic and optoelectronic assemblies. This creamy paste has a an easy to use 1:1 mix ratio with a 48 hour work time. Application is easily accomplished with automated syringe dispensing, screen printing, die stamping or by hand. Cure is as fast as 1 minute @ 175°C so used extensively for highspeed production. It produces a volume resistivity of 10-4 ohm-cm and a thermal conductivity of 2.5W/m°K.
The EO-20E has low ionic content and has been certified to NASA ASTM 595-7 for outgassing. Proven in microelectronic applications for its high strength and excellent thermal conductivity, EO-20E is a preferred choice for IC packaging and high powered LEDs.
EPOXIOHM™ EO-20E can be supplied in various kits sizes ranging from 2oz to 1lb. It can also be supplied premixed and frozen in 3cc,5cc, 10cc and 30cc syringes.
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