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Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
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Breaking News: Relive the Experience: Real Time with… IPC APEX EXPO 2024 Show & Tell Magazine
You came, you saw, and you experienced the magic of IPC APEX EXPO 2024. Now you get to relive the many memories and experiences in the pages of Real...
IMI Posts $290 Million of Revenues for Q1 of 2024
Integrated Micro-Electronics, Inc. (IMI) reports group revenues of US$290 million for Q1 2024, 16% lower than the previous year, partly due to the divestment of STI which was still contributing revenues to the company last...
NEOTech Positions Itself as Microelectronics Industry Leader with High-Technology Investments
NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial,...
OSI Systems Receives $6 Million Order for Electronic Assemblies
OSI Systems, Inc. announced that its Optoelectronics and Manufacturing division has received an order for approximately $6 million to provide...
Incap Releases Unaudited Business Review for January–March 2024
Revenue for the first quarter 2024 amounted to EUR 51.4 million (1–3/2023: EUR 72.2 million). Year-on-year the revenue decreased 29.3%, as...
Simbe Partners with Plexus to Scale Manufacturing and Meet Global Retail Demand
Simbe, the leading provider of Store Intelligence™ solutions that increase retailer performance through unprecedented visibility and insights,...
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IPC Raymond E. Pritchard Hall of Fame Award: Pierre-Jean Albrieux
May 10, 2024 | Marcy LaRont, PCB007 Magazine
Congratulations to Pierre-Jean Albrieux, who received the 2024 IPC Raymond E. Pritchard Hall of Fame Award. The award is given to individuals in recognition of the highest level of achievement, extraordinary contributions, and distinguished service to IPC and toward the advancement of the industry, including helping to create a spirit of mutual esteem, respect, and recognition among members consistent with the goals and mission of IPC.
Real Time with… IPC APEX EXPO 2024: Magnalytix's Services and Trends in the Electronics Industry
May 10, 2024 | Real Time with...IPC APEX EXPO
Mike Bixenman, president of Magnalytix, explains Magnalytix's services, including third-party validation, test boards, electrical testing, and comprehensive reports. He also discusses emerging trends such as power electronics and reliability. Standards and design improvements also form part of this conversation.
MORE ARTICLES
Nolan’s Notes: Coming to Terms With AI
May 7, 2024 | Nolan Johnson, Nolan's Notes
How fast do things move in the world of data analytics? Here’s an example. We’ve been planning this issue on artificial intelligence for the past few months, and, in fact, I had already written this column about a month ago. Then...
The Knowledge Base: A CM’s Perspective on Box Build Practices
April 30, 2024 | Mike Konrad, The Knowledge Base
In the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic...
SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1
April 17, 2024 | Dr. Jennie Hwang, SMT Perspectives and Prospects
In this installment of my artificial intelligence (AI) series, I will touch on the key foundational technologies that propel and drive the development and deployment of AI, with special consideration of electronics packaging and...
Nolan’s Notes: Do More, Get More
April 2, 2024 | Nolan Johnson, Nolan's Notes
This month in SMT007 Magazine, we’re investigating box build, a manufacturing sector so closely adjacent to board assembly that some OEM customers they’re the same thing. To those of us doing this work, we know they’re very...
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- Using AI to Redefine Productivity with Amin Arbabian, Anders Holden, Raj Vora, and Luis Vidal
- Empowering the Smart Factory Era With AI by Joel Scutchfield and Brent Fischthal
- A Glossary of Artificial Intelligence Terms
- Chiplet Architecture for AI Will Create New Demands for Assembly with Arvind Kumar
- The Rise of Collaborative Intelligence in Manufacturing by Jennifer Davis